Recently, centering on the theme of "Core World, Intelligent Future", focusing on advanced packaging, automotive-grade applications, and green sustainable development, it aims to assist the semiconductor industry in better creating new quality productivity in the AI era.
With the rapid development of artificial intelligence applications, the demand for more powerful, efficient and compact semiconductor chips has grown explosively. In the reality where Moore's Law is approaching its limit, the innovation of semiconductor manufacturers is no longer simply about reducing the size of transistors, but has shifted to how to package and stack them ingeniously.
This trend provides Henkel's adhesives with innovative impetus and development opportunities.
The iteration and innovation of advanced packaging technologies have become the key factors in enhancing the differentiated competitive advantages of semiconductor manufacturers. As a leader in the adhesive field, Henkel has always been driven by material innovation, continuously expanding its investment in key areas such as high-performance computing, AI terminals, and automotive semiconductors, and activating the development potential of next-generation semiconductor devices and AI technologies.
Help advanced packaging technology usher in the "core" era of artificial intelligence
As an innovative provider of electronic semiconductor solutions, Henkel is committed to offering reliable solutions to users and the market through its leading technological capabilities, thereby ushering in the "chip" era of artificial intelligence.
In response to the demands of high-performance computing chips for advanced packaging materials, Henkel has launched a low-stress, ultra-low warpage liquid compression molding packaging material, suitable for wafer-level packaging (WLP) and fan-out wafer-level packaging (FO-WLP), providing a guarantee for the "core" power in the era of artificial intelligence.
Meanwhile, Henkel's liquid molding underfill adhesive based on innovative technology can successfully simplify the process by combining the underfill and encapsulation steps, effectively enhancing the efficiency and reliability of packaging.
For advanced process chips, Henkel has launched capillary underfill adhesives for system-on-chip applications. By optimizing high rheological properties, it achieves a balance between uniform fluidity, precise deposition effect and rapid filling. Its outstanding process stability and bump protection function can effectively reduce stress damage in chip packaging.
In addition, this series of products can ensure reliability and process flexibility in complex production environments, effectively helping customers improve production efficiency and save costs, and thus providing support for opening a new chapter for the new generation of intelligent terminals.
Advanced automotive-grade solutions safeguard new energy vehicles
It is well known that the drive system and charging system of new energy vehicles are highly dependent on efficient energy conversion and stable power transmission, which has driven a sharp increase in the demand for power chips.
With years of rich experience and profound insights in the automotive-grade semiconductor field, Henkel has launched a number of breakthrough solutions, providing a solid shield for the high efficiency and reliability of multiple key automotive application systems.
It is understood that its excellent rheological properties ensure the stability of dispensing and compatibility with curved needles. Its low stress, strong adhesion, and high thermal conductivity after curing make it an ideal choice for semiconductor packaging with high thermal or electrical conductivity requirements.
Increase resource input and continuously deepen the cultivation of the Chinese market
As the world's largest manufacturing base for electronic products, China is an important market that all multinational enterprises cannot ignore.
China is one of Henkel's most important markets. Over the years, Henkel has continuously increased its investment, strengthened its supply chain construction and enhanced its local innovation capabilities.
Assist Henkel's Adhesive Technologies business unit in developing advanced adhesive, sealant and functional coating solutions, thereby better serving various industries and providing support to customers in China and the Asia-Pacific region.
For many years, Henkel has been deeply engaged in the Chinese and Asia-Pacific markets, firmly fulfilling its commitment to the long-term development of regional business, continuously increasing investment in the research and development of innovative technologies, and further enhancing its local operation capabilities.
In the future, we will provide more efficient and sustainable solutions to help China's semiconductor industry fully embrace the AI era, promote the development of new quality productivity, and jointly create a sustainable future.
